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mems fabrication and packaging represent the greatest challenge our industry has ever faced. not only are the advanced mems devices small and highly complex many must communicate with the outside world by methods other than electronic signals. and mems devices are so specific that each new one can represent a novel problem to solve.
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advanced mems packaging is perhaps the most difficult technical challenge facing the electronics industry. it combines some of the still unsolved riddles of 3d packaging with the difficulties of hermetic cavity packaging and the demands of non electronic signal sensing.this 550 page book is
Mems Sensors Led Optoelectronics Advanced Packaging System
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Advanced Rf Mems Switch Devices Using Glass Packaging
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